PECVD

PECVD technology – Plasma Enhanced Chemical Vapor Deposition (PECVD) is a process by which thin films of various materials can be deposited on substrates at lower temperature than that of standard Chemical Vapor Deposition (CVD).

Key advantages of IZOVAC's   PECVD technology :

  • High yield, due to:
  1. Fine  film thickness uniformity
  2. Minimizing film contamination - Particles free
  3. The ability to control the internal film stress in the layers (it's possible to get "0"-stresses)
  • High uptime - >90 %
  • The lowest cost of consumables coupled with high material utilization rate
  • High deposition rate

PECVD technique, developed by Izovac, allows achieving AR coating with the following characteristics:

  • — Flatness: Warp-free film averaging 0.035 mm
  • — Thickness uniformity: < ± 1,5%
  • — Index uniformity: < ±0.5%
  • — Transmission uniformity: < ±1.5%
  • — Transmission : > 90% from 400~700nm
  • — Reflection:
    a. RAvg(400~700nm)≦1.0%
    b. RMax(400~700nm)≦1.5% (it could be changed due to the customer color requirement)     
  • — Low absorption

AR coatings deposition could be combined with AF coating deposition in one cycle (AR+AF coating).