AURORA-I


Incline Vacuum systems for large scale mass production.

AURORA-I is inline vacuum coating system is a modification of vertical coater when substrate are loaded on the transport carrier with angle to vertical axise.
This solution allows to combine the advantage of vertical design (low particles process) with advantages of horizontal loading when uncoating area is minimized or is equal to zero.

Coater description.
Caoting system is consist of 2 parts: vacuum chambers and loading/unloading tables (can be configured for automation system) that are installed in clean room. Standard AURORA design is one-end, that means loading and unloading is made from one side and process coridor has turnback or shiftback chamber. Optionaly coater can be modified for two-ends design when loading and unloading is made from opposit sides.
Substrates are fixed on the transport carriers that goes through vacuum load lock chamber to process chamber (sputtering area) where they move with constant speed and without gap between each other.
Process chambers are equiped with all necessary technological systems for substrate cleaning, thin film coating and postreatment if required.
Coater control is made from HMI + PLC system in fully automated mode.
Control system can be integrated with Manufacturing execution system (MES)

Available generation.
By coating area size AURORA-V is available in the next versions:
- GEN 4.5 with coating area 650x1200 mm
Other variation (not standard) can be discussed.

Productivity.
Together with coating area size the main parametrer that define productivity is cycle tme (or tact time like in conveyor production). It is time between unloading transport carriers with coated substrates.
For Aurora-I platform the shortest cycle time is from 45 sec.

Process stability.
ZERO GAP transport system design (no gaps between transport carriers) ensure outstanding sputtering process stability that is required for high quality AR coating for display and touch industry.


Technology.
Having modular design AURORA-I coater structure can be scaled and optimized for different production task. The following technological devises can be used:
   - Ion Beam Cleaning system
   - RF plasma cleaning system
   - Planar magnetron sputtering station (DC or AC)
   - Cylindrical rotary magnetron sputtering station (DC or AC)
   - RF magnetrons
   - AF evaporation system (anti fingeprint coating system)
   - optical monitoring

Substrate type:
   - glass
   - PET (or other plastic films)
   - other material by request



For details about configuration please contact us for help.

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