SMART vacuum system is intended for a small-scale production as well as for R&D tasks.
The deposition of coatings is carried out by methods of resistive evaporation and/or magnetron sputtering with preliminary heating of substrates.
Optionally implementation of the system for etching process and RF plasma cleaning is available
TECHNOLOGICAL DEVICES:
• Inductively coupled plasma (ICP) source
• Ion-beam cleaning source
• DC-magnetron
• Resistive evaporation system
| Maximum substrate diameter, mm | 150 |
| Maximum coating thickness uniformity, % | ± 2,0 |
| Ultimate residual pressure in the clean, Pa | 5х10-4 |
| Coatings control | Quartz system for thickness control Control by time |