Main features:

  • Cylindrical magnetrons with >80% utilization
  • Double side deposition in single vacuum cycle
  • Magnetron with enhanced magnetic system designed especially for HJT cells
  • Edge isolation included
  • Precise heating and temperature control
  • Options: metallization process for seed layer

Technical data

Throughput       2400/3600 substrates/hour

Substrate          wafer 6 (other sizes  possible)

Coating area     (8x5) 6 wafers, 1340x835 mm

Coating Unif.%         ±5%

L/UL                          fully automated (optional)

Sputtering system    DC or DC Pulse

TCO thickness          Up to 120 nm

Target materials      ITO (90/10, 95/5, 97/3), ZnO:Al, Ag, NiV, other by request

Product list